Unit Process Engineer Professional

The position is for a semiconductor process engineer with a focus on processes related to electrochemical plating, compression, wire and ball bonding, and lithography processing. The processing engineer will work with engineers and scientists on a wide variety of packaging processing, such as electrochemical and electroless plating, wire, ball (stud), and thermal compression bonding (TCB), dry film lithography, inspection, and metrology. The candidate will be a part of a team in the Microelectronics Research Laboratory (MRL), which provides world class 200mm wafer scale fabrication services to multiple clients including Quantum Computing, Artificial Intelligence Center in Albany, government programs, as well as multiple Joint Development clients with projects in Health Care and Life science, and the Internet of Things.