Semiconductor Engineering Position (Yorktown Heights, Ny)

The position is for a semiconductor process engineer with a focus on processes related to packaging bonding. The processing engineer will work with engineers and scientists on a wide variety of packaging bonding processes such as wafer-to-wafer and metal-to-metal bonding, thermal compression bonding (TCB), inspection, metrology, and wet-dry cleans. The candidate will be a part of a team in the Microelectronics Research Laboratory (MRL), which provides world class 200mm wafer scale fabrication services to multiple clients including Quantum Computing, Artificial Intelligence Center in Albany, government programs, as well as multiple Joint Development clients with projects in Health Care and Life science, and the Internet of Things.