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Packaging Engineer

Packaging Engineer
Company:

Mastech Digital


Details of the offer

Mastech Digital provides digital and mainstream technology staff as well as Digital Transformation Services for all American Corporations. We are currently seeking a RF/mmWave Packaging Engineer for our client in the Consulting domain. We value our professionals, providing comprehensive benefits and the opportunity for growth. This is a Permanent position, and the client is looking for someone to start immediately.
Duration: Full-time
Location: Sunnyvale, CA
Salary: $130K-$192K/Annually or $65-$90/Hourly
Role: RF/mmWave Packaging Engineer Primary Skills: RF/mmWave Role Description: The RF/mmWave Packaging Engineer must have at least 3+ years of experience.
Responsibilities: - Design, simulate and validate advanced RF/mmWave packaging/module solutions.
- Liaise with OSAT vendors for manufacturing.
- Design, simulate and validate Integrated passive device (IPD).
- Liaise with foundry for tapeout.
- Design PCB schematic, layout and perform circuit and 3D EM simulation.
- RF lab debug, tuning, performance optimization and validation.
Required Skills: - 3+ years of experience in developing RF/mmWave packages and IPD design.
- In depth knowledge in electromagnetics, RF filters, PA and LNA design.
- Experience with foundry tapeout and working with OSAT vendors.
- Experience in RF schematics, layouts, and DFM.
- Experience with RF lab equipment and probe station for device characterization, debug, and component/system performance validation.
- Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.
- Good communicator and team player.
Education: - MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design
Preferred Skills: - 5+ years of relevant industry experience
- Familiar with RF system design.
- Familiar with regulatory requirements (FCC, CE, etc.).
Education: MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design/Bachelor?s degree in Computer Science, Electrical/Electronic Engineering, Information Technology or another related field or Equivalent
Experience: Minimum 3+ years of experience
Relocation: This position will not cover relocation expenses
Travel: No
Local Preferred: Yes
Note: Must be able to work on a W2 basis (No C2C) Recruiter Name: Haris Khan Recruiter Phone: Equal Employment Opportunity
Minimum Education Required: Masters
Years of Experience Required: At Least 3 Years
Expected Travel Time: None

Report this job Dice Id: gatpa001 Position Id: 288112


Source: Grabsjobs_Co

Job Function:

Requirements

Packaging Engineer
Company:

Mastech Digital


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